Correlation of Dielectric Properties with Structure and H-Bonding for Liquids

Bennett, Elliot L ORCID: 0000-0003-3798-4296, Calisir, Ilkan ORCID: 0000-0002-4199-9127, Yang, Xiantao, Huang, Yi ORCID: 0000-0001-7774-1024 and Xiao, Jianliang ORCID: 0000-0003-2010-247X (2023) Correlation of Dielectric Properties with Structure and H-Bonding for Liquids. The Journal of Physical Chemistry C, 127 (37). pp. 18669-18677.

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Official URL: http://dx.doi.org/10.1021/acs.jpcc.3c03484

Abstract

A study focused on the correlation among dielectric properties, molecular structure, and H-bonding is presented using liquid formamides with increasing carbon chain lengths as a model series. 1H NMR is used to determine the extent of H-bonding via Abraham solute hydrogen bond acidity parameter, A. The results show a clear quantitative correlation, with higher A linked with increased relaxation times (τ) and a drop in the static dielectric constants (ϵs), with differences between the 1 and 2° amides observed. Overall, the findings advance our understanding of the intricate relationship between dielectric properties and H-bonding, with potential applications toward the design of materials exhibiting tailored dielectric properties and the study of amide-containing molecules (such as DNA, peptides, proteins, and nylon polymers) and other liquids which may associate via H-bonding.

Item Type:	Article
Divisions:	Faculty of Science and Engineering > School of Physical Sciences
Depositing User:	Symplectic Admin
Date Deposited:	22 Sep 2023 09:15
Last Modified:	18 Oct 2023 18:54
DOI:	10.1021/acs.jpcc.3c03484
Open Access URL:	https://doi.org/10.1021/acs.jpcc.3c03484
Related URLs:	Author Publisher
URI:	https://livrepository.liverpool.ac.uk/id/eprint/3172961