(Invited) Vacuum Ultraviolet Photochemical Atomic Layer Deposition of Alumina and Titania Films



Chalker, Paul Raymond, Marshall, Paul A, Dawson, Karl, Sutcliffe, Christopher J, Brunell, Ian F, Sedghi, Naser, Hall, Stephen and Potter, Richard J
(2015) (Invited) Vacuum Ultraviolet Photochemical Atomic Layer Deposition of Alumina and Titania Films. ECS Transactions, 69 (7). pp. 139-145.

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Abstract

<jats:p>Conventional atomic layer deposition (ALD) is a thermo-chemical process where co-reagents are sequentially pulsed in cycles onto a heated substrate. As an alternative to substrate heating, various forms of other “non-thermal” ALD processes are being investigated. Herein, the photochemical atomic layer deposition of Al<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub> and TiO<jats:sub>2</jats:sub> thin films at 60°C is reported using a shuttered vacuum ultraviolet light source to excite molecular oxygen as a co-reagent with the metal precursors. The growth mechanisms using trimethyl aluminium and titanium tetraisopropoxide precursors, are investigated using in-situ quartz crystal microbalance and post-deposition ellipsometric measurements. The photochemical ALD Al<jats:sub>2</jats:sub>O<jats:sub>3</jats:sub> films exhibit different capacitance equivalent thicknesses for irradiated and masked regions respectively, even after post-deposition annealing. The photochemical ALD titania films are amorphous and when incorporated into Pt / TiO<jats:sub>2</jats:sub> / Pt metal - insulator - metal structures, the titania exhibits a resistive switching behavior.</jats:p>

Item Type: Article
Uncontrolled Keywords: 40 Engineering, 4018 Nanotechnology
Depositing User: Symplectic Admin
Date Deposited: 09 Feb 2017 11:43
Last Modified: 20 Jun 2024 19:07
DOI: 10.1149/06907.0139ecst
Related URLs:
URI: https://livrepository.liverpool.ac.uk/id/eprint/3005663