Two dimensional wetting of a stepped copper surface

Lin, C, Avidor, N, Corem, G, Godsi, O, Alexandrowicz, G, Darling, GR ORCID: 0000-0001-9329-9993 and Hodgson, A ORCID: 0000-0001-8677-7467 (2018) Two dimensional wetting of a stepped copper surface Physical Review Letters, 120 (7). 076101-. ISSN 0031-9007, 1079-7114

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Abstract

Highly corrugated, stepped surfaces present regular 1D arrays of binding sites, creating a complex, heterogeneous environment to water. Rather than decorating the hydrophilic step sites to form 1D chains, water on stepped Cu(511) forms an extended 2D network that binds strongly to the steps but bridges across the intervening hydrophobic Cu(100) terraces. The hydrogen-bonded network contains pentamer, hexamer, and octomer water rings that leave a third of the stable Cu step sites unoccupied in order to bind water H down close to the step dipole and complete three hydrogen bonds per molecule.

Item Type:	Article
Uncontrolled Keywords:	40 Engineering, 49 Mathematical Sciences, 51 Physical Sciences
Depositing User:	Symplectic Admin
Date Deposited:	12 Jan 2018 10:53
Last Modified:	01 Mar 2026 10:59
DOI:	10.1103/PhysRevLett.120.076101
Related Websites:	Author Publisher
URI:	https://livrepository.liverpool.ac.uk/id/eprint/3015939
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