A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors



Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2019) A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors. In: 2019 IEEE International Test Conference in Asia (ITC-Asia), 2019-09-03 - 2019-09-05.

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Item Type: Conference or Workshop Item (Unspecified)
Depositing User: Symplectic Admin
Date Deposited: 04 Jul 2019 15:21
Last Modified: 06 Aug 2021 22:11
DOI: 10.1109/itc-asia.2019.00034
URI: https://livrepository.liverpool.ac.uk/id/eprint/3048629