The application of texture discrimination to SMT QFP solder joint inspection

Wang, Jia-Chang (1998) The application of texture discrimination to SMT QFP solder joint inspection PhD thesis, University of Liverpool.

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Item Type:	Thesis (PhD)
Uncontrolled Keywords:	Engineering, Manufacturing, industrial management, solder
Depositing User:	Symplectic Admin
Date Deposited:	11 Jan 2022 14:55
Last Modified:	11 Jan 2022 14:57
DOI:	10.17638/03146567
Copyright Statement:	Copyright © and Moral Rights for this thesis and any accompanying data (where applicable) are retained by the author and/or other copyright owners. A copy can be downloaded for personal non-commercial research or study, without prior permission or charge.
Digitisation Notes :	No issues with pagination throughout. No missing pages in annexes.
URI:	https://livrepository.liverpool.ac.uk/id/eprint/3146567
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