The application of texture discrimination to SMT QFP solder joint inspection



Wang, Jia-Chang
(1998) The application of texture discrimination to SMT QFP solder joint inspection. PhD thesis, University of Liverpool.

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Item Type: Thesis (PhD)
Uncontrolled Keywords: Engineering, Manufacturing, industrial management, solder
Depositing User: Symplectic Admin
Date Deposited: 11 Jan 2022 14:55
Last Modified: 11 Jan 2022 14:57
DOI: 10.17638/03146567
Copyright Statement: Copyright © and Moral Rights for this thesis and any accompanying data (where applicable) are retained by the author and/or other copyright owners. A copy can be downloaded for personal non-commercial research or study, without prior permission or charge.
Digitisation Notes : No issues with pagination throughout. No missing pages in annexes.
URI: https://livrepository.liverpool.ac.uk/id/eprint/3146567