3D Imaging of Electrical-Thermal-Mechanical Deformation on Bonding Wire Loops using Phase-Sensitive Line-field Optical Coherence Tomography

Zhao, Zhiyi, Zhang, Zijian ORCID: 0000-0002-3004-6697, Yang, Xingyu ORCID: 0000-0003-2871-8025, Hu, Yihua, Xu, Ju and Shen, Yaochun ORCID: 0000-0002-8915-1993 (2022) 3D Imaging of Electrical-Thermal-Mechanical Deformation on Bonding Wire Loops using Phase-Sensitive Line-field Optical Coherence Tomography. In: Digital Holography and Three-Dimensional Imaging, 2022 - ?.

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Abstract

<jats:p>The repetitive electrical-thermal-mechanical deformation causes bonding wires failures that can damage whole power electronic modules. The LF-OCT can measure electrical-thermal-mechanical deformation on a bonding wire's loop, which can help the reliability analysis of bonding wires.</jats:p>

Item Type:	Conference or Workshop Item (Unspecified)
Uncontrolled Keywords:	40 Engineering, 4009 Electronics, Sensors and Digital Hardware, Bioengineering, Biomedical Imaging
Divisions:	Faculty of Health and Life Sciences Faculty of Health and Life Sciences > Institute of Life Courses and Medical Sciences Faculty of Science and Engineering > School of Electrical Engineering, Electronics and Computer Science
Depositing User:	Symplectic Admin
Date Deposited:	11 Mar 2024 10:35
Last Modified:	22 Nov 2024 07:30
DOI:	10.1364/dh.2022.tu4a.2
Related URLs:	Publisher
URI:	https://livrepository.liverpool.ac.uk/id/eprint/3179247