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Akiba, K
ORCID: 0000-0002-6736-471X, Alexander, M
ORCID: 0000-0002-8148-2392, Bertella, C
ORCID: 0000-0002-3160-147X, Biolchini, A
ORCID: 0000-0001-6064-9993, Bitadze, A
ORCID: 0000-0001-7979-1092, Bogdanova, G
ORCID: 0009-0000-9524-4670, Borghi, S
ORCID: 0000-0001-5135-1511, Bowcock, TJV
ORCID: 0000-0002-3505-6915, Bridges, K, Brock, M et al (show 77 more authors) , Burke, AT
ORCID: 0000-0003-0243-0517, Buytaert, J
ORCID: 0000-0002-7958-6790, Byczynski, W
ORCID: 0009-0008-0187-3395, Carroll, J
ORCID: 0000-0001-6562-1105, Coco, V
ORCID: 0000-0002-5310-6808, Collins, P
ORCID: 0000-0003-1437-4022, Davis, A
ORCID: 0000-0001-9458-5115, De Aguiar Francisco, O
ORCID: 0000-0003-2735-678X, De Bruyn, K
ORCID: 0000-0002-0615-4399, De Capua, S
ORCID: 0000-0002-6285-9596, De Roo, K, Doherty, F
ORCID: 0000-0001-6470-4881, Douglas, L, Dufour, L
ORCID: 0000-0002-3924-2774, Dumps, R, Dutta, D
ORCID: 0000-0002-1191-3978, Eklund, L
ORCID: 0000-0002-2014-3864, Elvin, A
ORCID: 0009-0006-0882-3900, Farry, S
ORCID: 0000-0001-5119-9740, Fernandez Prieto, A
ORCID: 0000-0003-1984-6367, Franco Lima, V
ORCID: 0000-0002-3761-209X, Freestone, J, Fuzipeg, C
ORCID: 0009-0009-5347-9354, Galati, MD
ORCID: 0000-0002-8716-4440, Gallas Torreira, A
ORCID: 0000-0002-2745-7954, Geertsema, RE
ORCID: 0000-0001-6829-7777, Gersabeck, E
ORCID: 0000-0002-2860-6528, Gersabeck, M
ORCID: 0000-0002-0075-8669, Grant, F
ORCID: 0009-0009-0474-0317, Halewood-leagas, T
ORCID: 0000-0001-9629-7029, Hennessy, K
ORCID: 0000-0002-1529-8087, Hulsbergen, W
ORCID: 0000-0003-3018-5707, Hutchcroft, D
ORCID: 0000-0002-4174-6509, Hynds, D
ORCID: 0009-0009-0976-2312, Jans, E
ORCID: 0000-0002-5438-9176, John, D, John, M
ORCID: 0000-0002-8579-844X, Jurik, N
ORCID: 0000-0002-6066-7232, Ketel, T
ORCID: 0000-0002-9652-1964, Klaver, S
ORCID: 0000-0001-7909-1272, Kopciewicz, P
ORCID: 0000-0001-9092-3527, Kostiuk, I
ORCID: 0000-0002-8767-7289, Kraan, M, Langstaff, M
ORCID: 0009-0006-8036-6716, Latham, T
ORCID: 0000-0002-7195-8537, Leflat, A
ORCID: 0000-0001-9619-6666, Lemos Cid, E
ORCID: 0000-0003-3001-6268, Lukashenko, V
ORCID: 0000-0002-0630-5185, Merk, M
ORCID: 0000-0003-0818-4695, Milovanovic, M
ORCID: 0000-0003-1580-0898, Monk, M
ORCID: 0000-0003-0484-0157, Murray, D
ORCID: 0000-0002-5729-8675, Nasteva, I
ORCID: 0000-0001-7115-7214, Oblakowska-Mucha, A
ORCID: 0000-0003-1328-0534, Pajero, T
ORCID: 0000-0001-9630-2000, Parkes, C
ORCID: 0000-0003-4174-1334, Pazos Alvarez, A
ORCID: 0000-0003-3153-8084, Perez Trigo, E
ORCID: 0000-0001-7650-6639, Perry, M
ORCID: 0009-0003-2617-0964, Reiss, F
ORCID: 0000-0002-8395-7654, Rinnert, K
ORCID: 0000-0001-9802-1122, Rodriguez Rodriguez, E
ORCID: 0000-0002-7973-8061, Rovekamp, J, Sanders, F, Scantlebury Smead, LG
ORCID: 0000-0001-8702-7991, Schiller, M
ORCID: 0000-0001-8750-863X, Shears, T
ORCID: 0000-0002-2653-1366, Smith, NA
ORCID: 0000-0002-3638-809X, Snoch, A
ORCID: 0000-0001-6431-6360, Švihra, P
ORCID: 0000-0002-7811-2147, Szumlak, T
ORCID: 0000-0002-2562-7163, van Beuzekom, M
ORCID: 0000-0002-0500-1286, van Overbeek, M, Vazquez Regueiro, P
ORCID: 0000-0002-0767-9736, Volkov, V
ORCID: 0009-0005-3500-5121, Wormald, M and Zunica, G
ORCID: 0000-0002-5972-6290
(2024)
The LHCb VELO Upgrade module construction.
Journal of Instrumentation, 19 (06).
P06023-P06023.
ISSN 1748-0221, 1748-0221
Access the full-text of this item by clicking on the
Open Access link.
Abstract
<jats:title>Abstract</jats:title>
<jats:p>The LHCb detector has undergone a major upgrade for LHC
Run 3. This Upgrade I detector facilitates operation at higher
luminosity and utilises full-detector information at the LHC
collision rate, critically including the use of vertex
information. A new vertex locator system, the VELO Upgrade, has been
constructed. The core element of the new VELO are the double-sided
pixelated hybrid silicon detector modules which operate in vacuum
close to the LHC beam in a high radiation environment. The
construction and quality assurance tests of these modules are
described in this paper. The modules incorporate
200 μm thick, n-on-p silicon sensors bump-bonded to
130 nm technology ASICs. These are attached with high precision to
a silicon microchannel substrate that uses evaporative CO<jats:sub>2</jats:sub>
cooling. The ASICs are controlled and read out with flexible printed
circuits that are glued to the substrate and wire-bonded to the
chips. The mechanical support of the module is given by a carbon
fibre plate, two carbon fibre rods and an aluminium plate. The
sensor attachment was achieved with an average precision of
21 μm, more than 99.5% of all pixels are fully
functional, and a thermal figure of merit of
3 Kcm<jats:sup>2</jats:sup>W<jats:sup>-1</jats:sup> was achieved. The production of the
modules was successfully completed in 2021, with the final assembly
and installation completed in time for data taking in 2022.</jats:p>