Microstructural development in flip-chip solder bonds



Mockler, Alan John
(1995) Microstructural development in flip-chip solder bonds. PhD thesis, University of Liverpool.

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Item Type: Thesis (PhD)
Depositing User: Symplectic Admin
Date Deposited: 23 Oct 2024 06:38
Last Modified: 23 Oct 2024 09:17
DOI: 10.17638/03186057
Copyright Statement: Copyright © and Moral Rights for this thesis and any accompanying data (where applicable) are retained by the author and/or other copyright owners. A copy can be downloaded for personal non-commercial research or study, without prior permission or charge.
URI: https://livrepository.liverpool.ac.uk/id/eprint/3186057