Correlation of Dielectric Properties with Structure and H-Bonding for Liquids

Bennett, Elliot L ORCID: 0000-0003-3798-4296, Calisir, Ilkan ORCID: 0000-0002-4199-9127, Yang, Xiantao, Huang, Yi ORCID: 0000-0001-7774-1024 and Xiao, Jianliang ORCID: 0000-0003-2010-247X
(2023) Correlation of Dielectric Properties with Structure and H-Bonding for Liquids. The Journal of Physical Chemistry C, 127 (37). pp. 18669-18677.

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A study focused on the correlation among dielectric properties, molecular structure, and H-bonding is presented using liquid formamides with increasing carbon chain lengths as a model series. 1H NMR is used to determine the extent of H-bonding via Abraham solute hydrogen bond acidity parameter, A. The results show a clear quantitative correlation, with higher A linked with increased relaxation times (τ) and a drop in the static dielectric constants (ϵs), with differences between the 1 and 2° amides observed. Overall, the findings advance our understanding of the intricate relationship between dielectric properties and H-bonding, with potential applications toward the design of materials exhibiting tailored dielectric properties and the study of amide-containing molecules (such as DNA, peptides, proteins, and nylon polymers) and other liquids which may associate via H-bonding.

Item Type: Article
Divisions: Faculty of Science and Engineering > School of Physical Sciences
Depositing User: Symplectic Admin
Date Deposited: 22 Sep 2023 09:15
Last Modified: 18 Oct 2023 18:54
DOI: 10.1021/acs.jpcc.3c03484
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