Browse by People


Up a level
Export as [feed] RSS [feed] RSS 2.0 Short Author List
Number of items: 3.


Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2020) A Cost-Aware Framework for Lifetime Reliability of TSV based 3D-IC design. IEEE Transactions on Circuits and Systems II: Express Briefs. 1 - 1.


Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2017) A Cost-Effective Fault Tolerance Technique for Functional TSV in 3-D ICs. IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 25 (7). 2071 - 2080.


Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2019) A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors. In: 2019 IEEE International Test Conference in Asia (ITC-Asia), 2019-09-03 - 2019-09-05.

This list was generated on Wed Mar 18 11:12:41 2020 GMT.