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Number of items: 4.


Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2020) A Cost-Aware Framework for Lifetime Reliability of TSV-Based 3D-IC Design. IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 67 (11). 2677 - 2681.


Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2017) A Cost-Effective Fault Tolerance Technique for Functional TSV in 3-D ICs. IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 25 (7). 2071 - 2080.


Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2019) A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors. In: 2019 IEEE International Test Conference in Asia (ITC-Asia), 2019-09-03 - 2019-09-05.


Kalanadhabhatta, Srisubha, Anumandla, Kiran Kumar, Khursheed, Saqib, Acharyya, Amit and IEEE,
(2020) Secure Scan Design with a Novel Methodology of Scan Camouflaging. .

This list was generated on Sun Jul 18 14:43:30 2021 BST.