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Number of items: 6.


Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2020) A Cost-Aware Framework for Lifetime Reliability of TSV-Based 3D-IC Design. IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 67 (11). 2677 - 2681.


Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2017) A Cost-Effective Fault Tolerance Technique for Functional TSV in 3-D ICs. IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 25 (7). 2071 - 2080.


Reddy, Raviteja P, Acharyya, Amit, Khursheed, Saqib and IEEE,
(2019) A Framework for TSV based 3D-IC to Analyze Aging and TSV Thermo-mechanical stress on Soft Errors. .


Kalanadhabhatta, Srisubha, Dutt, Rashi, Khursheed, Saqib, Acharyya, Amit and IEEE,
(2021) IC age estimation methodology using IO pad protection diodes for prevention of Recycled ICs. .


Narwariya, Anmol, Das, Pabitra, Khursheed, Syed-Saqib and Acharyya, Amit
(2022) Operational Age Estimation of ICs using Gaussian Process Regression. In: 35th IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems., 2022-10-19 - 2022-9-21, Austin, TX, USA.


Kalanadhabhatta, Srisubha, Anumandla, Kiran Kumar, Khursheed, Saqib, Acharyya, Amit and IEEE,
(2020) Secure Scan Design with a Novel Methodology of Scan Camouflaging. .

This list was generated on Thu Nov 24 11:04:48 2022 GMT.