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Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2020)
A Cost-Aware Framework for Lifetime Reliability of TSV-Based 3D-IC Design.
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 67 (11).
pp. 2677-2681.
Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2017)
A Cost-Effective Fault Tolerance Technique for Functional TSV in 3-D ICs.
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 25 (7).
pp. 2071-2080.
Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2019)
A Framework for TSV based 3D-IC to Analyze Aging and TSV Thermo-mechanical stress on Soft Errors.
In: 2019 IEEE International Test Conference in Asia (ITC-Asia), 2019-9-3 - 2019-9-5, Tokyo, Japan.
Kalanadhabhatta, Srisubha, Dutt, Rashi, Khursheed, Saqib, Acharyya, Amit and IEEE,
(2021)
IC age estimation methodology using IO pad protection diodes for prevention of Recycled ICs.
In: 2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021-5-22 - 2021-5-28.
Narwariya, Anmol Singh, Das, Pabitra, Khursheed, Saqib and Acharyya, Amit
(2022)
Operational Age Estimation of ICs using Gaussian Process Regression.
In: 2022 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), 2022-10-19 - 2022-10-21, Austin, TX, USA.
Kalanadhabhatta, Srisubha, Anumandla, Kiran Kumar, Khursheed, Saqib and Acharyya, Amit
(2020)
Secure Scan Design with a Novel Methodology of Scan Camouflaging.
In: 2020 European Conference on Circuit Theory and Design (ECCTD), 2020-9-7 - 2020-9-10, Sofia, Bulgaria.