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Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2020)
A Cost-Aware Framework for Lifetime Reliability of TSV-Based 3D-IC Design.
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 67 (11).
pp. 2677-2681.
Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2017)
A Cost-Effective Fault Tolerance Technique for Functional TSV in 3-D ICs.
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 25 (7).
pp. 2071-2080.
Reddy, Raviteja P, Acharyya, Amit and Khursheed, Saqib
(2019)
A Framework for TSV based 3D-IC to Analyze Aging and TSV Thermo-mechanical stress on Soft Errors.
In: 2019 IEEE International Test Conference in Asia (ITC-Asia), 2019-9-3 - 2019-9-5, Tokyo, Japan.