Chang, Yin-Cheng, Wang, Jiayou, Lin, Ta-Yeh, Hsieh, Chao-Ping, Huang, Yi 
ORCID: 0000-0001-7774-1024, Hsu, Shawn SH and Chang, Da-Chiang
(2022)
3D Chip-level Broadband Measurement Technique for Radiated EM Emission.
In: 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022, 2022-6-19 - 2022-6-24.
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Abstract
This paper proposes a novel broadband 3D chip-level radiated EM emission measurement technique. Two different test carriers with the embedded CPW and coil conductors respectively are designed and realized by the integrated passive device (IPD) process, which allow collecting the EM emission via near-field coupling. Using an in-house designed 0.18-μm CMOS VCO as the DUT, the emission spectrum obtained using the CPW conductor demonstrates a broadband characteristic up to above 20 GHz with an excellent agreement of the direct measurements. Compared to the traditional IEC standard approaches typically limited below 3 GHz, the proposed high sensitivity and broadband technique is suitable for evaluating EM interference of high-frequency ICs in advanced 3D packaging.
| Item Type: | Conference or Workshop Item (Unspecified) |
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| Uncontrolled Keywords: | 3D, Broadband, chip-level, EMI, EMC, IPD, voltage-controlled oscillator (VCO) |
| Divisions: | Faculty of Science and Engineering > School of Electrical Engineering, Electronics and Computer Science |
| Depositing User: | Symplectic Admin |
| Date Deposited: | 06 Jan 2023 09:43 |
| Last Modified: | 06 Jan 2023 09:43 |
| DOI: | 10.1109/IMS37962.2022.9865275 |
| Related URLs: | |
| URI: | https://livrepository.liverpool.ac.uk/id/eprint/3166794 |
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